US 11,954,235 B1
One-way communication data diode on a chip
Sang Cheon Lee, Ashburn, VA (US); and Colin Patrick Dunn, Falls Church, VA (US)
Assigned to Fend Incorporated, Arlington, VA (US)
Filed by Fend Incorporated, Arlington, VA (US)
Filed on Jun. 12, 2023, as Appl. No. 18/333,484.
Application 18/333,484 is a continuation of application No. 18/068,316, filed on Dec. 19, 2022, granted, now 11,709,970.
This patent is subject to a terminal disclaimer.
Int. Cl. G06F 21/71 (2013.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01)
CPC G06F 21/71 (2013.01) [H05K 1/0213 (2013.01); H05K 1/181 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10174 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A data diode on a chip, comprising:
a substrate for the chip comprising a first portion and a second portion;
an input side disposed on a first portion of the substrate, comprising:
a first processing element;
a transmitter optical sub-assembly, coupled to the first processing element; and
an output side disposed on a second portion of the substrate, comprising:
a second processing element; and
a receiver optical sub-assembly, coupled to the second processing element,
wherein the transmitter optical sub-assembly and the receiver optical sub-assembly provide a one-way data bridge coupled between the first processing element and the second processing element that allows data flow from the first processing element to the second processing element and physically prohibits data flow from the second processing element to the first processing element.