US 11,953,830 B2
Photosensitive resin composition, photosensitive resin sheet, cured film, method for producing cured film, organic EL display device and electronic component
Yusuke Komori, Otsu (JP); Takashi Sumi, Otsu (JP); and Kazuto Miyoshi, Otsu (JP)
Assigned to TORAY INDUSTRIES, INC., Tokyo (JP)
Appl. No. 17/436,941
Filed by TORAY INDUSTRIES, INC., Tokyo (JP)
PCT Filed Mar. 4, 2020, PCT No. PCT/JP2020/009104
§ 371(c)(1), (2) Date Sep. 7, 2021,
PCT Pub. No. WO2020/184326, PCT Pub. Date Sep. 17, 2020.
Claims priority of application No. 2019-046742 (JP), filed on Mar. 14, 2019.
Prior Publication US 2022/0155680 A1, May 19, 2022
Int. Cl. G03F 7/023 (2006.01); G03F 7/40 (2006.01); H01L 23/532 (2006.01); H10K 59/122 (2023.01); H10K 59/124 (2023.01)
CPC G03F 7/0233 (2013.01) [G03F 7/40 (2013.01); H01L 23/5329 (2013.01); H10K 59/122 (2023.02); H10K 59/124 (2023.02)] 15 Claims
OG exemplary drawing
 
1. A photosensitive resin composition comprising:
a polyimide precursor (a), the polyimide precursor (a) having a residue derived from a diamine having an ionization potential of less than 7.1 eV;
a phenol compound (b) having an electron withdrawing group; and
a photosensitive compound (c).