US 11,953,825 B2
Imprint apparatus, imprint method, and manufacturing method of semiconductor device
Masayuki Hatano, Kanagawa (JP); Kei Kobayashi, Kanagawa (JP); and Tetsuro Nakasugi, Kanagawa (JP)
Assigned to Kioxia Corporation, Tokyo (JP)
Filed by Kioxia Corporation, Tokyo (JP)
Filed on Jan. 16, 2023, as Appl. No. 18/154,995.
Application 18/154,995 is a division of application No. 16/297,875, filed on Mar. 11, 2019.
Claims priority of application No. 2018-159345 (JP), filed on Aug. 28, 2018.
Prior Publication US 2023/0221635 A1, Jul. 13, 2023
Int. Cl. G03F 7/00 (2006.01); H01L 21/027 (2006.01)
CPC G03F 7/0002 (2013.01) [H01L 21/0274 (2013.01)] 11 Claims
OG exemplary drawing
 
1. An imprint apparatus that presses a pattern of an original plate against a photo-curable resin dropped onto a substrate, and transfers the pattern to the photo-curable resin by applying light, the apparatus comprising:
a dropping unit that drops the photo-curable resin onto a plurality of shot regions obtained by dividing the substrate into a plurality of sections;
an original plate supporting unit that contacts the pattern of the original plate to the photo-curable resin on the substrate;
a substrate supporting unit that supports the substrate and moves the substrate, a predetermined shot region of the substrate being moved to a dropping position of the dropping unit or a contacting position of the original plate; and
a processor including a counting unit that counts an order in which the photo-curable resin is dropwise for each of the plurality of shot regions,
wherein the dropping unit is controlled to drop the photo-curable resin onto the plurality of shot regions of the substrate sequentially before contacting the original plate to the photo-curable resin on any of the plurality of shot regions, and
the original plate supporting unit is controlled to contact the original plate to the photo-curable resin dropped onto the plurality of shot regions sequentially based on the order of a dropwise of the photo-curable resin to transfer the pattern to the resin, while operating the substrate supporting unit.