US 11,953,779 B2
Backlight module, method for designing the same, and display device
Xiaoxin Song, Beijing (CN); Feng Zhang, Beijing (CN); Wenqu Liu, Beijing (CN); Zhijun Lv, Beijing (CN); Liwen Dong, Beijing (CN); Zhao Cui, Beijing (CN); Detian Meng, Beijing (CN); Libo Wang, Beijing (CN); Dongfei Hou, Beijing (CN); Qi Yao, Beijing (CN); and Xue Dong, Beijing (CN)
Assigned to BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
Appl. No. 17/770,205
Filed by BOE Technology Group Co., Ltd., Beijing (CN)
PCT Filed Jun. 8, 2021, PCT No. PCT/CN2021/098962
§ 371(c)(1), (2) Date Apr. 19, 2022,
PCT Pub. No. WO2022/012226, PCT Pub. Date Jan. 20, 2022.
Claims priority of application No. 202010677555.5 (CN), filed on Jul. 14, 2020.
Prior Publication US 2022/0373840 A1, Nov. 24, 2022
Int. Cl. G02F 1/00 (2006.01); G02F 1/1335 (2006.01); G02F 1/13357 (2006.01)
CPC G02F 1/133603 (2013.01) [G02F 1/133605 (2013.01); G02F 1/133607 (2021.01); G02F 1/133612 (2021.01)] 16 Claims
OG exemplary drawing
 
1. A backlight module, comprising:
a first substrate;
a plurality of light emitting diode chips on the first substrate, wherein the plurality of light emitting diode chips are arranged on the first substrate in an array in a first direction and a second direction;
a light control structure on the first substrate, wherein the light control structure is configured to: receive light emitted from the light emitting diode chips, and control a light flux distribution of light emitted from the light control structure;
a first conductive layer on the first substrate, wherein the first conductive layer comprises a plurality of first wirings;
a second conductive layer on a side of the first conductive layer away from the first substrate, wherein the second conductive layer comprises a plurality of second wirings; and
a first cover layer on the first substrate, wherein the first cover layer is formed of a light transmitting material, and the first cover layer is configured to fill at least gaps among the plurality of first wirings,
wherein the backlight module comprises a plurality of light control region groups, the plurality of light control region groups are in one-to-one correspondence with the plurality of light emitting diode chips, each light control region group comprises at least a first light control region and a second light control region, an orthographic projection of the first light control region of each light control region group on the first substrate covers an orthographic projection of the light emitting diode chip corresponding to the light control region group on the first substrate, an orthographic projection of the second light control region of the each light control region group on the first substrate encloses the orthographic projection of the first light control region of the light control region group on the first substrate;
wherein the light control structure comprises a plurality of light control substructure groups, the plurality of light control substructure groups are respectively located in the plurality of light control region groups, and each light control substructure group comprises at least a first light control substructure and a second light control substructure;
wherein each of the light control substructures comprises a plurality of light transmitting portions and a plurality of light reflecting portions, and a proportion of the light transmitting portions in the first light control substructure is different from a proportion of the light transmitting portions in the second light control substructure; and
wherein the plurality of light reflecting portions of the light control structure comprises the plurality of first wirings and the plurality of second wirings, and the plurality of light transmitting portions of the light control structure comprise parts of the first cover layer in the gaps among the plurality of first wirings.