US 11,953,740 B2
Package structure
Chung-Ming Weng, Hsinchu (TW); Chen-Hua Yu, Hsinchu (TW); Chung-Shi Liu, Hsinchu (TW); Hao-Yi Tsai, Hsinchu (TW); Cheng-Chieh Hsieh, Tainan (TW); Hung-Yi Kuo, Taipei (TW); Tsung-Yuan Yu, Taipei (TW); Hua-Kuei Lin, Hsinchu (TW); and Che-Hsiang Hsu, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on May 14, 2021, as Appl. No. 17/320,228.
Prior Publication US 2022/0365297 A1, Nov. 17, 2022
Int. Cl. G02B 6/42 (2006.01); H01L 23/00 (2006.01)
CPC G02B 6/4243 (2013.01) [G02B 6/4214 (2013.01); G02B 6/4239 (2013.01); G02B 6/4251 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package structure comprising:
a photonic die comprising an optical coupler;
an electronic die electrically coupled to the photonic die;
an encapsulant laterally encapsulating the photonic die and the electronic die; and
a waveguide disposed over the encapsulant and comprising an upper surface facing away from the encapsulant, wherein the waveguide comprises a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.