US 11,953,562 B2
MI sensor and method for manufacturing MI sensor
Tatsufumi Kusuda, Kyoto (JP)
Assigned to NIDEC-READ CORPORATION, Muko (JP)
Appl. No. 17/043,768
Filed by NIDEC-READ CORPORATION, Kyoto (JP)
PCT Filed May 21, 2019, PCT No. PCT/JP2019/020076
§ 371(c)(1), (2) Date Sep. 30, 2020,
PCT Pub. No. WO2020/003815, PCT Pub. Date Jan. 2, 2020.
Claims priority of application No. 2018-121668 (JP), filed on Jun. 27, 2018.
Prior Publication US 2021/0109169 A1, Apr. 15, 2021
Int. Cl. G01R 33/06 (2006.01); H01F 27/28 (2006.01); H01F 41/04 (2006.01)
CPC G01R 33/063 (2013.01) [H01F 27/28 (2013.01); H01F 41/04 (2013.01)] 9 Claims
OG exemplary drawing
 
1. An MI sensor comprising:
a linear magnetic conductor;
an insulator layer formed on an outer peripheral surface of the magnetic conductor; and
a first coil, a second coil, and a third coil which are formed, in a spiral shape, on an outer peripheral surface of the insulator layer,
wherein the first coil, the second coil, and the third coil are formed of a conductive layer,
the first coil, the second coil, and the third coil are arranged in directions orthogonal to each other, and
wherein the linear magnetic conductor is bent between the first coil and the second coil and is bent between the second coil and third coil.