US 11,953,392 B1
Packaging structure and method of MEMS pressure sensor
Tongqing Liu, Jiangsu (CN)
Assigned to Wuxi Sencoch Semiconductor Co., Ltd., Wuxi (CN)
Filed by Wuxi Sencoch Semiconductor Co., Ltd., Jiangsu (CN)
Filed on Sep. 21, 2023, as Appl. No. 18/370,897.
Claims priority of application No. 202211151572.0 (CN), filed on Sep. 21, 2022; and application No. 202211151573.5 (CN), filed on Sep. 21, 2022.
Int. Cl. G01L 9/06 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); G01L 19/04 (2006.01); G01L 19/06 (2006.01)
CPC G01L 19/0618 (2013.01) [B81B 7/0032 (2013.01); B81C 1/00261 (2013.01); B81C 1/0069 (2013.01); G01L 19/04 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A packaging structure of an MEMS pressure sensor, including:
a film, forming a sealing chamber with a base, wherein the sealing chamber is internally equipped with a sensing medium and a pressure sensor chip, when the external pressure increases, the film bends towards an inner side of the sealing chamber to cause the sealing chamber to contract and transmit pressure to the pressure sensor chip through the sensing medium;
a sealing cover, located on the base and suspended on one side of the film away from the sealing chamber, and
a first electrode connected to the film and a second electrode connected to the sealing cover, wherein in a case that voltages access the sealing cover and the film through the corresponding electrodes, an electrostatic attraction is generated between the sealing cover and the film to balance an overloaded pressure.