US 11,953,382 B2
Calibration tool for planar chip applications
Manuel Künz, Keltern (DE); Daniel Ahr, Neuenbürg (DE); Martin Trump, Pforzheim (DE); and Rüdiger Retzlaff, Birkenfeld (DE)
Assigned to STRATEC SE, Birkenfeld (DE)
Filed by STRATEC SE, Birkenfeld (DE)
Filed on Aug. 9, 2020, as Appl. No. 16/988,656.
Claims priority of application No. 1911386 (GB), filed on Aug. 9, 2019.
Prior Publication US 2021/0041306 A1, Feb. 11, 2021
Int. Cl. G01K 1/02 (2021.01); B01L 7/00 (2006.01); B01L 9/00 (2006.01); G01N 35/00 (2006.01)
CPC G01K 1/026 (2013.01) [B01L 7/52 (2013.01); B01L 9/527 (2013.01); B01L 2200/025 (2013.01); B01L 2200/028 (2013.01); B01L 2200/147 (2013.01); B01L 2200/148 (2013.01); G01N 2035/00366 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A device for measuring temperatures, comprising:
a sensor array plate, comprising on a first surface at least one temperature sensor arranged on at least one tongue that is surrounded by a cut-out leaving a bridge to the sensor array plate, wherein separate spacers are arranged on the first surface of the sensor array plate on both sides of the at least one temperature sensor, and a second surface opposite the first surface for contacting at least one operating plate of a member of an automated analyser system, wherein a first thermal pad is arranged between the at least one temperature sensor and the sensor array plate and the first thermal pad is connected by thermal bridges to a second thermal pad on the second surface of the sensor array plate; and
a pressure plate, comprising fins at a side for connection to the sensor array plate that align with the spacers of the sensor array plate when the pressure plate is arranged onto the sensor array plate.