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1. A flow sensor chip comprising: a substrate in which a cavity having an opening is formed; a membrane provided on a surface of the substrate so as to cover the opening; a heater provided inside the membrane; a first thermopile and a second thermopile provided in the membrane, the heater being interposed between the first thermopile and the second thermopile; a heat conduction member serving as a heat conduction path between the substrate and the membrane, wherein a first hot junction and a first cold junction of a thermocouple provided in the first thermopile and a second hot junction and a second cold junction of a thermocouple provided in the second thermopile are arranged at positions overlapping with the opening as viewed from a direction normal to the surface of the substrate; the heat conduction member includes: a first heat conduction member serving as a heat conduction path between the first cold junction and the substrate; and a second heat conduction member serving as a heat conduction path between the second cold junction and the substrate; wherein the first heat conduction member is provided on a surface of the membrane on an opposite side from the substrate, the first heat conduction member extends from an area where the membrane and the substrate overlap with each other to a position closer to the first hot junction than is the first cold junction, as viewed from the direction normal to the surface of the substrate, the second heat conduction member is provided on a surface of the membrane on an opposite side from the substrate, and the second heat conduction member extends from an area where the membrane and the substrate overlap with each other to a position closer to the second hot junction than is the second cold junction, as viewed from the direction normal to the surface of the substrate.
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