US 11,953,314 B2
Imaging device, bump inspection device, and imaging method
Alexsandr Juk, Saint-Laurent (CA); Alain Ross, Saint-Laurent (CA); Takashi Miyasaka, Muko (JP); Takeya Tsukamoto, Muko (JP); and Shigeya Kikuta, Muko (JP)
Assigned to NIDEC READ CORPORATION, Muko (JP)
Filed by NIDEC READ CORPORATION, Muko (JP)
Filed on Jan. 11, 2023, as Appl. No. 18/152,791.
Application 18/152,791 is a division of application No. 16/631,844, granted, now 11,585,652, previously published as PCT/JP2017/046718, filed on Dec. 26, 2017.
Claims priority of application No. 2017-140202 (JP), filed on Jul. 19, 2017.
Prior Publication US 2023/0160691 A1, May 25, 2023
Int. Cl. G01B 11/25 (2006.01); G06T 7/00 (2017.01); H04N 23/56 (2023.01)
CPC G01B 11/2522 (2013.01) [G06T 7/0004 (2013.01); H04N 23/56 (2023.01); G06T 2207/30148 (2013.01)] 6 Claims
OG exemplary drawing
 
1. An imaging device for imaging a substrate that includes bumps that are on a substrate surface and are arranged at positions that correspond to points of intersection of a grid, the imaging device comprising:
a light emitting portion that emits light in a direction that is inclined relative to the substrate surface;
an imaging portion that images the substrate surface onto which the light is emitted; and
a direction adjusting portion that adjusts an arrangement relation between the direction in which the light is emitted and an orientation of the substrate to allow a diagonal direction that passes through diagonal positions of the grid to substantially correspond to the direction in which the light is emitted, in a plan view,
wherein the imaging portion images the substrate while the diagonal direction substantially corresponds to the direction in which the light is emitted, in a plan view.