US 11,953,272 B2
Cycling heat dissipation module
Cheng-Yu Cheng, New Taipei (TW); Wen-Neng Liao, New Taipei (TW); and Cheng-Wen Hsieh, New Taipei (TW)
Assigned to Acer Incorporated, New Taipei (TW)
Filed by Acer Incorporated, New Taipei (TW)
Filed on Mar. 24, 2021, as Appl. No. 17/210,511.
Application 17/210,511 is a division of application No. 16/293,642, filed on Mar. 6, 2019, granted, now 10,996,006.
Claims priority of application No. 107107762 (TW), filed on Mar. 7, 2018.
Prior Publication US 2021/0207898 A1, Jul. 8, 2021
Int. Cl. F28D 15/00 (2006.01); F28F 13/02 (2006.01); H05K 7/20 (2006.01)
CPC F28F 13/02 (2013.01) [H05K 7/20309 (2013.01); H05K 7/20318 (2013.01); H05K 7/20327 (2013.01); H05K 7/20409 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A cycling heat dissipation module, configured to dissipate heat generated from a heat source, the cycling heat dissipation module comprising:
an evaporator, having an outlet and an inlet; and
a piping, connected to the outlet and the inlet of the evaporator to form a loop, a working fluid filled in the loop, wherein the working fluid in liquid-state is transformed into vapor-state by absorbing heat in the evaporator and flows out of the evaporator through the outlet, the piping having a heat-blocking segment and a condensing segment, wherein the heat-blocking segment is disposed between the outlet and the condensing segment, and the working fluid in vapor-state is transformed into liquid-state by dissipating heat in the condensing segment and flows into the evaporator through the inlet, wherein the cycling heat dissipation module and the heat source are disposed in a housing of an electronic device, the condensing segment is contacted with a base of the housing, and the heat-blocking segment is supported at a higher position relative to the condensing segment, the base, and the evaporator via a supporting structure to prevent surrounding elements of the electronic device from being affected by heat.