US 11,952,678 B2
Method for manufacturing etched SiC substrate and grown SiC substrate by material tranportation and method for epitaxial growth by material transportation
Tadaaki Kaneko, Hyogo (JP)
Assigned to KWANSEI GAKUIN EDUCATIONAL FOUNDATION, Hyogo (JP); and TOYOTA TSUSHO CORPORATION, Nagoya (JP)
Appl. No. 17/606,738
Filed by KWANSEI GAKUIN EDUCATIONAL FOUNDATION, Hyogo (JP); and TOYOTA TSUSHO CORPORATION, Nagoya (JP)
PCT Filed Apr. 24, 2020, PCT No. PCT/JP2020/017642
§ 371(c)(1), (2) Date Oct. 26, 2021,
PCT Pub. No. WO2020/218482, PCT Pub. Date Oct. 29, 2020.
Claims priority of application No. JP2019-086713 (JP), filed on Apr. 26, 2019.
Prior Publication US 2022/0213615 A1, Jul. 7, 2022
Int. Cl. C30B 23/06 (2006.01); C30B 25/10 (2006.01); C30B 25/20 (2006.01); C30B 29/36 (2006.01)
CPC C30B 25/20 (2013.01) [C30B 25/10 (2013.01); C30B 29/36 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A method for manufacturing a SiC substrate, comprising:
disposing two SiC single crystal substrates facing each other in a main container made of a SiC material, and performing simultaneously the following transporting of a raw material by heating the main container,
transporting a raw material from one side of one SiC single crystal substrate to one side of the other SiC single crystal substrate, performing an etching of the one side of the one SiC single crystal substrate and a formation of a growth layer on the one side of the other SiC single crystal substrate,
transporting a raw material from the main container to an other side of the one SiC single crystal substrate, performing a formation of a growth layer on the other side of the one SiC single crystal substrate, and
transporting a raw material from an other side of the other SiC single crystal substrate to the main container, performing an etching of the other side of the other SiC single crystal substrate.