	US 11,952,675 B2
	Surface-treated copper foil and method for manufacturing same
Toshio Kawasaki, Chikusei (JP); and Yasuhiro Endo, Chikusei (JP)
Assigned to NIPPON DENKAI, LTD., Chikusei (JP)
Appl. No. 17/787,847
Filed by NIPPON DENKAI, LTD., Chikusei (JP)
PCT Filed Nov. 10, 2020, PCT No. PCT/JP2020/041840 § 371(c)(1), (2) Date Jun. 21, 2022, PCT Pub. No. WO2021/131359, PCT Pub. Date Jul. 1, 2021.
Claims priority of application No. 2019-232813 (JP), filed on Dec. 24, 2019.
Prior Publication US 2023/0043755 A1, Feb. 9, 2023
Int. Cl. C25D 5/12 (2006.01); C23C 28/00 (2006.01); C25D 5/00 (2006.01); C25D 5/16 (2006.01); C25D 5/48 (2006.01); C25D 7/06 (2006.01); H05K 1/09 (2006.01); H05K 3/38 (2006.01)

CPC C25D 5/12 (2013.01) [C23C 28/30 (2013.01); C25D 5/16 (2013.01); C25D 5/48 (2013.01); C25D 5/605 (2020.08); C25D 7/0614 (2013.01); H05K 1/09 (2013.01); H05K 3/384 (2013.01); Y10T 428/12438 (2015.01)]

6 Claims

1. A surface-treated copper foil comprising:

an electrolytic copper foil;

a roughened layer covering at least one surface side of the electrolytic copper foil; and

a rust preventive layer further covering the roughened layer,

wherein the rust preventive layer is at least one surface of the surface-treated copper foil; the rust preventive layer comprises at least a nickel layer; and a thickness of the nickel layer is 0.8 to 4.4 g/m²in terms of mass per unit area of nickel; and

a noncontact roughness Spd of the rust preventive layer is 1.4 to 2.6 peaks/μm²and a surface roughness RzJIS of the rust preventive layer is 1.0 to 2.5 μm.