US 11,952,665 B2
Coated metal alloy substrates and process of production thereof
Kuan-Ting Wu, Taipei (TW); Hsing-Hung Hsieh, Taipei (TW); and Super Liao, Taipei (TW)
Assigned to Hewlett-Packard Development Company, L.P., Spring, TX (US)
Appl. No. 17/298,901
Filed by Hewlett-Packard Development Company, L.P., Spring, TX (US)
PCT Filed Jun. 11, 2019, PCT No. PCT/US2019/036491
§ 371(c)(1), (2) Date Jun. 1, 2021,
PCT Pub. No. WO2020/251549, PCT Pub. Date Dec. 17, 2020.
Prior Publication US 2022/0112609 A1, Apr. 14, 2022
Int. Cl. C23C 28/00 (2006.01); C09D 5/24 (2006.01); C09D 5/44 (2006.01); C25D 13/12 (2006.01)
CPC C23C 28/00 (2013.01) [C09D 5/24 (2013.01); C09D 5/4411 (2013.01); C09D 5/443 (2013.01); C25D 13/12 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A coated metal alloy substrate for an electronic device comprising:
a metal alloy substrate and a passivation layer deposited on the metal alloy substrate;
a porous conductive water borne carbon nanotube layer on the passivation layer; and
an electrophoretic deposition layer deposited on the porous conductive water borne carbon nanotube layer, wherein the porous conductive water borne carbon nanotube layer comprises 30 to 75 wt % porous carbon nanotubes and 0.3 to 5.0 wt. % water borne resin, based on the total weight of the porous conductive water borne carbon nanotube layer.