US 11,952,263 B2
Micromechanical sensor device and corresponding manufacturing method
Mike Schwarz, Frankenberg (DE); Pascal Gieschke, Reutlingen (DE); and Valentina Kramer-Sinzinger, Eningen Unter Achalm (DE)
Assigned to ROBERT BOSCH GMBH, Stuttgart (DE)
Appl. No. 17/419,511
Filed by Robert Bosch GmbH, Stuttgart (DE)
PCT Filed Feb. 5, 2020, PCT No. PCT/EP2020/052848
§ 371(c)(1), (2) Date Jun. 29, 2021,
PCT Pub. No. WO2020/164988, PCT Pub. Date Aug. 20, 2020.
Claims priority of application No. 10 2019 201 768.1 (DE), filed on Feb. 12, 2019.
Prior Publication US 2022/0081281 A1, Mar. 17, 2022
Int. Cl. B81B 3/00 (2006.01)
CPC B81B 3/0018 (2013.01) [B81B 2201/0264 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/0315 (2013.01); B81B 2203/033 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A micromechanical sensor device, comprising:
a cap substrate which has a first front side facing in a first direction and a first back side facing in a second direction, and which has a through-opening as a media entry region; and
a sensor substrate which has a second front side facing in the first direction and a second back side facing in the second direction, and in which a sensor region is entirely arranged, the sensor region being embedded in an island-like region of the sensor substrate suspended on a remaining region of the sensor substrate, the island-like region being mechanically decoupled from the remaining region of the sensor substrate by a lateral stress-relief trench and a cavity situated in the sensor substrate, underneath the island-like region;
wherein the first back side is bonded to the second front side in such a manner, that the through opening is situated above the sensor region; and
wherein the sensor region is covered by a gel, which fills the through-opening and the stress-relief trench at least partially, such that an exterior surface of the sensor region that faces in the first direction is exposed to the gel at the second front side.