US 11,951,739 B2
Fluidic die with high aspect ratio power bond pads
Eric Thomas Martin, Corvallis, OR (US); Gary G. Lutnesky, Corvallis, OR (US); James R. Przybyla, Corvallis, OR (US); and Rogelio Cicili, San Diego, CA (US)
Assigned to Hewlett-Packard Development Company, L.P., Spring, TX (US)
Appl. No. 17/799,708
Filed by Hewlett-Packard Development Company, L.P., Spring, TX (US)
PCT Filed Mar. 9, 2020, PCT No. PCT/US2020/021689
§ 371(c)(1), (2) Date Aug. 15, 2022,
PCT Pub. No. WO2021/183100, PCT Pub. Date Sep. 16, 2021.
Prior Publication US 2023/0071745 A1, Mar. 9, 2023
Int. Cl. B41J 2/14 (2006.01); B41J 2/045 (2006.01)
CPC B41J 2/14072 (2013.01) [B41J 2/04543 (2013.01); B41J 2/0458 (2013.01); B41J 2/04581 (2013.01); B41J 2002/14491 (2013.01); B41J 2202/11 (2013.01); B41J 2202/20 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A fluidic die, comprising:
a substrate;
fluid actuators disposed on the substrate; and
a bond pad region defined on the substrate, the bond pad region comprising:
a high aspect ratio power delivery bond pad with multiple bonding sites; and
a high aspect ratio power return bond pad with multiple bonding sites.