US 11,951,590 B2
Polishing pads with interconnected pores
Shiyan Akalanka Jayanath Wewala Gonnagahadeniyage, Santa Clara, CA (US); Ashwin Chockalingam, Santa Clara, CA (US); Jason Garcheung Fung, Santa Clara, CA (US); Veera Raghava Reddy Kakireddy, Santa Clara, CA (US); Nandan Baradanahalli Kenchappa, San Jose, CA (US); Puneet Narendra Jawali, San Jose, CA (US); and Rajeev Bajaj, Fremont, CA (US)
Assigned to APPLIED MATERIALS, INC., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Jun. 14, 2021, as Appl. No. 17/346,399.
Prior Publication US 2022/0395958 A1, Dec. 15, 2022
Int. Cl. B24B 37/26 (2012.01)
CPC B24B 37/26 (2013.01) 20 Claims
OG exemplary drawing
 
1. A polishing pad, comprising:
a plurality of polishing elements, each polishing element comprising:
a plurality of individual posts, each individual post comprising:
an individual surface that forms a portion of a polishing surface of the polishing pad; and
one or more sidewalls extending downwardly from the individual surface; and
a plurality of grooves disposed between adjacent polishing elements of the plurality of polishing elements, wherein
each polishing element of the plurality of polishing elements has a width of 5 mm or less, and
the sidewalls of the plurality of individual posts define a plurality of pores between adjacent individual posts of the plurality of individual posts, each pore of the plurality of pores having a width of 120 μm or less.