US 11,951,588 B2
Optical film-thickness measuring apparatus and polishing apparatus
Masaki Kinoshita, Tokyo (JP); Toshifumi Kimba, Tokyo (JP); Yoshikazu Kato, Tokyo (JP); and Yoichi Shiokawa, Tokyo (JP)
Assigned to EBARA CORPORATION, Tokyo (JP)
Filed by EBARA CORPORATION, Tokyo (JP)
Filed on Sep. 17, 2021, as Appl. No. 17/478,608.
Claims priority of application No. 2020-168845 (JP), filed on Oct. 6, 2020.
Prior Publication US 2022/0105601 A1, Apr. 7, 2022
Int. Cl. B24B 37/013 (2012.01); G01N 21/55 (2014.01)
CPC B24B 37/013 (2013.01) [G01N 21/55 (2013.01)] 11 Claims
OG exemplary drawing
 
1. An optical film-thickness measuring apparatus to be installed in a polishing apparatus for a workpiece, comprising:
a light source;
a light-emitting optical fiber cable coupled to the light source;
a light-receiving optical fiber cable arranged to receive light reflected from the workpiece;
a spectrometer configured to measure intensity of the reflected light at each of the wavelengths of the reflected light;
a data processing device configured to calculate a film thickness of the workpiece from measurement data of the intensity of the reflected light;
a cable housing surrounding the light-emitting optical fiber cable and the light-receiving optical fiber cable; and
a flow-passage structure defining a fluid passage adjacent to the light-emitting optical fiber cable and the light-receiving optical fiber cable, the light-emitting optical fiber cable and the light-receiving optical fiber cable being in contact with an inner surface of the cable housing and an outer surface of the flow-passage structure and being supported by both the cable housing and the flow-passage structure.