US 11,951,571 B2
Method of forming package structure
Cheng-Fu Yu, Milpitas, CA (US); Kai-Jih Shih, Milpitas, CA (US); and Yi-Jung Liu, Milpitas, CA (US)
Assigned to INTEGRATED SILICON SOLUTION INC., Milpitas, CA (US)
Filed by Integrated Silicon Solution Inc., Milpitas, CA (US)
Filed on Feb. 2, 2023, as Appl. No. 18/163,338.
Application 18/163,338 is a continuation of application No. 17/109,264, filed on Dec. 2, 2020, granted, now 11,612,965.
Claims priority of provisional application 63/000,545, filed on Mar. 27, 2020.
Claims priority of application No. 109130277 (TW), filed on Sep. 3, 2020.
Prior Publication US 2023/0173615 A1, Jun. 8, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. B23K 26/38 (2014.01); B23K 26/364 (2014.01); H01L 21/78 (2006.01); H01L 23/544 (2006.01)
CPC B23K 26/38 (2013.01) [B23K 26/364 (2015.10); H01L 21/78 (2013.01); H01L 23/544 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A method of forming a package structure, comprising:
an etching step, wherein a plurality of cutting streets of a leadframe are etched;
a laser step, wherein a plastic package material covering on each of the cutting streets is removed via a laser beam;
a plating step, wherein a plurality of plating surfaces are disposed on a plurality of areas of the leadframe without the plastic package material; and
a singulation step, wherein the cutting streets of the leadframe are cut to form the package structure;
wherein a portion of an upper surface of each of the cutting streets of the leadframe is removed via the laser beam in the laser step.