US 11,951,568 B2
Machining process for microfluidic and micromechanical devices
Charles Baur, St Aubin Sauges (CH); Yves Bellouard, Lutry (CH); Daniele Braga, Lugano-Massagno (CH); Thomas Fussinger, Zûrich (CH); David Lambelet, Neuchâtel (CH); Andrea Lovera, Pregassona (CH); Sacha Pollonghini, Neuchâtel (CH); and Arno Rogg, Cupertino, CA (US)
Assigned to Femtoprint SA, Muzzano (CH)
Appl. No. 16/767,498
Filed by Femtoprint SA, Muzzano (CH)
PCT Filed Nov. 28, 2017, PCT No. PCT/IB2017/057439
§ 371(c)(1), (2) Date May 27, 2020,
PCT Pub. No. WO2019/106407, PCT Pub. Date Jun. 6, 2019.
Prior Publication US 2020/0353566 A1, Nov. 12, 2020
Int. Cl. B23K 26/354 (2014.01); B23K 26/06 (2014.01); B23K 26/0622 (2014.01); B23K 26/362 (2014.01); B23K 101/36 (2006.01); B23K 103/00 (2006.01)
CPC B23K 26/354 (2015.10) [B23K 26/0622 (2015.10); B23K 26/0648 (2013.01); B23K 26/362 (2013.01); B23K 2101/36 (2018.08); B23K 2103/54 (2018.08); B23K 2103/56 (2018.08)] 20 Claims
OG exemplary drawing
 
1. A method for micro-fabricating a device out of a substrate, comprising the steps of:
providing a cavity having a temporary aperture communicating with the outside;
applying heat to a perimeter of the temporary aperture until melting of the substrate and wherein the melted substrate closes the temporary aperture, wherein the application of heat includes directing a beam of radiation or high-velocity particles, for example an infrared beam from a CO2 laser, on the sealing structure, the radiation beam having a transverse width that is smaller than the device and of the cavity and larger than a transverse dimension of the sealing structure or of the temporary aperture.