US 11,950,926 B2
Electronic device with magnetic assembly
Chao Wei Liu, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Mar. 25, 2022, as Appl. No. 17/705,213.
Prior Publication US 2023/0301591 A1, Sep. 28, 2023
Int. Cl. H05K 5/00 (2006.01); A61B 5/00 (2006.01); H01F 7/02 (2006.01); H05K 5/02 (2006.01)
CPC A61B 5/6801 (2013.01) [H01F 7/02 (2013.01); H05K 5/0217 (2013.01); A61B 2562/164 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a bendable body having a first portion and a second portion; and
an electronic component located at the first portion and the second portion of the bendable body;
wherein the first portion and the second portion are configured to repel each other within in a distance; and
wherein the bendable body comprises a base supporting the electronic component and an encapsulant covering the electronic component, and wherein a first magnetic element and a second magnetic element is disposed in the base or the encapsulant.