US 12,598,993 B2
Three-dimensional integrated circuit
Kambiz Vafai, Mission Viejo, CA (US); and Sainan Lu, Jurupa Valley, CA (US)
Assigned to KV Innovations, LLC, Albuquerque, NM (US)
Filed by KAMBIX INNOVATIONS, LLC, Albuquerque, NM (US)
Filed on Feb. 17, 2023, as Appl. No. 18/111,427.
Claims priority of provisional application 63/312,210, filed on Feb. 21, 2022.
Prior Publication US 2023/0282548 A1, Sep. 7, 2023
Int. Cl. H01L 23/427 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/427 (2013.01) [H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 25/0657 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73204 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/14511 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A three-dimensional (3D) integrated circuit device, comprising:
a thermal interface material layer configured above or from a substrate;
a plurality of die, a device layer and a micro-bump thermal interface material layer formed above thermal interface material layer;
a heat spreader located above the plurality of die, the device layer and the thermal interface material, the heat spreader comprising a flat-shaped heat pipe selected from a rectangular-shaped heat pipe and a disk-shaped heat pipe; and
a heat sink located above the heat spreader, the heat sink selected from the rectangular-shaped heat pipe and the disk-shaped heat pipe, wherein the flat-shaped heat pipe is employed as both the heat spreader and the heat sink to improve a thermal performance of the 3D IC.