US 12,274,043 B2
Resin molded body, and method for manufacturing same
Motoharu Haga, Tokyo (JP)
Assigned to Daicel Corporation, Osaka (JP)
Appl. No. 18/015,111
Filed by Daicel Corporation, Osaka (JP)
PCT Filed Jul. 8, 2021, PCT No. PCT/JP2021/025842
§ 371(c)(1), (2) Date Jan. 9, 2023,
PCT Pub. No. WO2022/009960, PCT Pub. Date Jan. 13, 2022.
Claims priority of application No. 2020-117885 (JP), filed on Jul. 8, 2020; and application No. 2020-117923 (JP), filed on Jul. 8, 2020.
Prior Publication US 2023/0255010 A1, Aug. 10, 2023
Int. Cl. H05K 9/00 (2006.01); H01F 27/28 (2006.01)
CPC H05K 9/0081 (2013.01) [H01F 27/28 (2013.01)] 29 Claims
OG exemplary drawing
 
1. A resin molded body comprising:
resin; and
a conductive member having a coil shape with a center axis, wherein the number of conductive members in the resin molded body is 5 members/cm2 or greater;
with a flat surface in at least part of the resin molded body, wherein an average angle between the flat surface and the center axis is 50° or greater.