US 12,274,039 B2
Optical module and method of manufacturing optical module
Kazuya Nagashima, Tokyo (JP); Maiko Ariga, Tokyo (JP); Atsushi Izawa, Tokyo (JP); and Jun Miyokawa, Tokyo (JP)
Assigned to FURUKAWA ELECTRIC CO., LTD., Tokyo (JP)
Filed by FURUKAWA ELECTRIC CO., LTD., Tokyo (JP)
Filed on Jul. 27, 2022, as Appl. No. 17/874,439.
Application 17/874,439 is a continuation of application No. PCT/JP2021/002326, filed on Jan. 22, 2021.
Claims priority of application No. 2020-011857 (JP), filed on Jan. 28, 2020.
Prior Publication US 2022/0369524 A1, Nov. 17, 2022
Int. Cl. H04B 10/00 (2013.01); G02B 6/42 (2006.01); H01S 5/023 (2021.01); H01S 5/02345 (2021.01); H01S 5/024 (2006.01); H01S 5/0683 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 9/00 (2006.01)
CPC H05K 9/0024 (2013.01) [G02B 6/4246 (2013.01); H01S 5/023 (2021.01); H01S 5/02345 (2021.01); H01S 5/02469 (2013.01); H01S 5/0683 (2013.01); H05K 1/0224 (2013.01); H05K 1/115 (2013.01); H05K 1/118 (2013.01); H05K 1/189 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10439 (2013.01)] 21 Claims
OG exemplary drawing
 
1. An optical module comprising:
an optical element;
a housing configured to house the optical element;
an electrical terminal arranged on an outer peripheral surface of the housing and electrically connected to an inside of the housing;
a positioning unit configured to determine a relative position of a wiring board electrically connected to the electrical terminal from outside of the housing, with respect to the electrical terminal;
a wiring board electrically connected to the electrical terminal from outside of the housing, wherein:
the wiring board includes a wiring-board-side positing unit that corresponds to the positioning unit, and
electrical wiring formed on the wiring board is one of a coplanar line, a microstripline, and a coplanar line including a ground surface; and
an organic sheet thermally bonded or bonded with resin on a signal line of the wiring board, or a resin coating applied onto the signal line of the wiring board, wherein:
a ground surface is formed on one of an upper surface of the organic sheet or the resin coating, and
conductive via holes are formed between two or three ground surfaces at a narrow pitch of 0.03 to 5 millimeters.