US 12,274,036 B2
Heatsink for co-packaged optical switch rack package
Radhakrishnan L. Nagarajan, Santa Clara, CA (US); Liang Ding, Singapore (SG); Mark Patterson, Santa Clara, CA (US); Roberto Coccioli, Santa Clara, CA (US); and Steve Aboagye, Santa Clara, CA (US)
Assigned to MARVELL ASIA PTE LTD, Singapore (SG)
Filed by MARVELL ASIA PTE, LTD., Singapore (SG)
Filed on Mar. 16, 2023, as Appl. No. 18/184,934.
Application 18/184,934 is a continuation of application No. 17/398,877, filed on Aug. 10, 2021, granted, now 11,612,079.
Application 17/398,877 is a continuation of application No. 16/894,639, filed on Jun. 5, 2020, granted, now 11,109,515, issued on Aug. 31, 2021.
Prior Publication US 2023/0225090 A1, Jul. 13, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 7/20 (2006.01); G02B 6/42 (2006.01); G02B 6/43 (2006.01); H01L 23/427 (2006.01); H01L 25/16 (2023.01); H04Q 11/00 (2006.01)
CPC H05K 7/20672 (2013.01) [G02B 6/4269 (2013.01); G02B 6/428 (2013.01); G02B 6/43 (2013.01); H01L 23/427 (2013.01); H01L 25/167 (2013.01); H04Q 11/0005 (2013.01); H05K 7/20154 (2013.01); H05K 7/2039 (2013.01); H05K 7/20572 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An optical module comprising:
a processor disposed on a substrate and a plurality of light engines for transmitting and receiving optical data disposed at different locations around the processor on the substrate, the processor controlling the light engines, the processor and the light engines generating different amounts of heat during operation; and
a heatsink in thermal communication with the processor and the light engines, the heatsink comprising a plurality of heat pipes non-uniformly distributed throughout the heatsink to remove the different amounts of the heat generated at a location of the processor and respective locations of each of the light engines.