| CPC H05K 7/2049 (2013.01) [G02B 6/445 (2013.01); H05K 5/0069 (2013.01); H05K 7/026 (2013.01); H05K 7/10 (2013.01); H05K 7/20336 (2013.01); H05K 7/20418 (2013.01)] | 20 Claims |

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1. A hardened optical platform comprising:
a hardened enclosure including a planar rear surface having an inside within the hardened enclosure and an outside exposed to an outside environment outside of the hardened enclosure, a door that when closed environmentally seals the hardened enclosure, and heat fins disposed on the outside of the planar rear surface in the outside environment outside of the hardened enclosure;
a first set of one or more modules disposed in one or more housings disposed within the hardened enclosure, each housing including a planar rear thermal contact surface that is enlarged relative to a remainder of the housing; and
high-speed cabling interconnecting the first set of one or more modules to a second set of one or more modules,
wherein the first set of one or more modules is passively cooled with the hardened enclosure by the enlarged planar rear thermal contact surface of each of the one or more housings directly abutting and making a direct surface-to-surface thermal contact with the inside of the planar rear surface of the hardened enclosure within the hardened enclosure opposite the heat fins disposed on the outside of the planar rear surface of the hardened enclosure in the outside environment and the door being weatherproof thereby having no airflow internally from a surrounding environment.
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