US 12,274,026 B2
Systems for cooler devices and cooling manifolds
Sougata Hazra, Stanford, CA (US); Chi Zhang, Palo Alto, CA (US); Mehdi Asheghi, Oakland, CA (US); Kenneth E. Goodson, Portola Valley, CA (US); Ercan M. Dede, Ann Arbor, MI (US); James Palko, Merced, CA (US); and Sreekant Narumanchi, Littleton, CO (US)
Assigned to Toyota Motor Engineering & Manufacturing North America Inc., Plano, TX (US); Alliance for Sustainable Energy, LLC, Golden, CO (US); The Regents of the University of California, Merced, Merced, CA (US); The Board of Trustees of the Leland Stanford Junior University, Stanford, CA (US); and United States Department of Energy, Washington, DC (US)
Filed by Toyota Motor Engineering & Manufacturing North America Inc., Plano, TX (US); The Board of Trustees of the Leland Stanford Junior University, Stanford, CA (US); The Regents of the University of California, Merced, Merced, CA (US); and Alliance for Sustainable Energy, LLC, Golden, CO (US)
Filed on May 19, 2022, as Appl. No. 17/748,429.
Prior Publication US 2023/0380106 A1, Nov. 23, 2023
Int. Cl. H05K 7/20 (2006.01); F28F 9/22 (2006.01)
CPC H05K 7/20272 (2013.01) [F28F 9/22 (2013.01); H05K 7/20254 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A cooler device comprising:
a manifold constructed at least partially of silicon, comprising:
an array of inlet channels, each inlet channel having a first depth;
an array of outlet channels interlaced with the array of inlet channels, each outlet channel having a second depth that is larger than the first depth, each of the array of outlet channels having a pair of sidewalls separating each outlet channel from adjacent inlet channels of the array of inlet channels;
a manifold case configured to be in contact with a cold plate and encapsulate the manifold, the array of inlet channels, and the array of outlet channels, the manifold case comprising:
a fluid inlet;
a fluid outlet, wherein the fluid inlet is for receiving coolant into the manifold, and the fluid outlet is for removing the liquid coolant from the; and
at least one vapor outlet, wherein the at least one vapor outlet is for removing a vapor from the manifold.