US 12,274,024 B2
Cooling device for cooling components of a circuit board
Anthony Robinson, Cork (IE); Cathal Wilson, Cork (IE); and Kenneth O'Mahony, Cork (IE)
Assigned to Nexalus Limited, Cork (IE)
Appl. No. 18/017,727
Filed by Nexalus Limited, Cork (IE)
PCT Filed Jul. 7, 2021, PCT No. PCT/EP2021/068865
§ 371(c)(1), (2) Date Jan. 24, 2023,
PCT Pub. No. WO2022/022966, PCT Pub. Date Feb. 3, 2022.
Claims priority of application No. 2011601 (GB), filed on Jul. 27, 2020.
Prior Publication US 2023/0254995 A1, Aug. 10, 2023
Int. Cl. H05K 7/20 (2006.01); G06F 1/20 (2006.01)
CPC H05K 7/20254 (2013.01) [G06F 1/20 (2013.01); H05K 7/20436 (2013.01); G06F 2200/201 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A thermal cooling device for cooling electronic components of a circuit board, the electronic components comprising a primary electronic component, and one or more secondary electronic components, the device comprising:
a first cooling component comprising a first cooling member configured to contact a thermal contact surface of the primary electronic component, the first cooling member being further configured to be in fluid communication with a fluid to effect an operative convective cooling of the thermal contact surface of the primary electronic component, the first cooling component comprising a microjet array defining a convection cooling area at least partially overlapping with the thermal contact surface of the primary electronic component and within which pressurised fluid operatively directly contacts the thermal contact surface to dissipate heat away from the thermal contact surface; and
a second cooling component comprising a second cooling member having a cooling distal region configured to contact a respective thermal surface of the one or more secondary electronic components to effect an operative conduction cooling of the one or more secondary electronic components, the second cooling member having a cooling proximal region thermally coupled to the first cooling member;
where the convection cooling operatively effected by the first cooling component has a first cooling effectiveness, the conduction cooling operatively effected by the second cooling component has a second cooling effectiveness lower than the first cooling effectiveness so as to operatively form a temperature depression at a perimeter of the first cooling component;
wherein the first cooling component comprises a housing defining a chamber configured to facilitate circulation of the fluid and the first cooling component further comprises a conduction plate extending sidewardly from the housing, the thermal depression operatively being formed in the conduction plate.