US 12,274,019 B2
Back plate and electronic device
Jinqiang (Jeff) Wang, Qingdao (CN); Zhiqiang (Simon) Li, Shanghai (CN); Guoxiao (Neo) Shen, Shanghai (CN); Jiefeng (Lear) Zhang, Shanghai (CN); and Brian Patrick Costello, Scotts Valley, CA (US)
Assigned to TE Connectivity Solutions GmbH, Schaffhausen (CH); Tyco Electronics (Shanghai) Co., Ltd, Shanghai (CN); and Tyco Electronics AMP Qingdao Ltd., Qingdao (CN)
Filed by Tyco Electronics AMP Qingdao Ltd, Qingdao (CN); Tyco Electronics (Shanghai) Co., Ltd., Shanghai (CN); and TE Connectivity Services GmbH, Schaffhausen (CH)
Filed on Nov. 30, 2021, as Appl. No. 17/538,127.
Claims priority of application No. 202011385410.4 (CN), filed on Dec. 1, 2020.
Prior Publication US 2022/0174836 A1, Jun. 2, 2022
Int. Cl. H05K 7/14 (2006.01); H01R 12/70 (2011.01); H01R 13/62 (2006.01); H05K 7/10 (2006.01)
CPC H05K 7/1439 (2013.01) [H05K 7/1417 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A back plate configured to support a circuit board, comprising
a body;
a central recess formed into a top surface of the body;
a raised main support column extending from the central recess and adapted to support the circuit board; and
a plurality of additional raised support columns extending from the central recess of the back plate, the plurality of additional support columns being distributed around the main support column.