US 12,274,008 B2
Solder-printing stencil and method of printing solder paste
Zhuhui Li, Guangdong (CN)
Assigned to SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD., Guangdong (CN)
Appl. No. 17/754,896
Filed by SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD., Guangdong (CN)
PCT Filed Mar. 22, 2022, PCT No. PCT/CN2022/082181
§ 371(c)(1), (2) Date Apr. 14, 2022,
PCT Pub. No. WO2023/155267, PCT Pub. Date Aug. 24, 2023.
Claims priority of application No. 202210154782.9 (CN), filed on Feb. 21, 2022.
Prior Publication US 2024/0306307 A1, Sep. 12, 2024
Int. Cl. H05K 3/12 (2006.01)
CPC H05K 3/1225 (2013.01) [H05K 3/1233 (2013.01); H05K 2203/0139 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A solder-printing stencil, the solder-printing stencil is for printing a solder paste on a substrate in cooperation with a squeegee blade, wherein the solder-printing stencil comprises:
a stencil body, the stencil body comprising a first region, a second region, and a third region, wherein the third region is defined between the first region and the second region, and the third region is provided with a plurality of mesh holes spaced along a squeegeeing direction of the squeegee blade; and
a protruding portion, the protruding portion provided on a side of the stencil body facing the substrate, wherein both of the first region and the second region are provided with the protruding portion, and the protruding portion has a strip shape;
wherein a second wire is disposed on the substrate, and the protruding portion is arranged to cross the second wire; and a surface of the protruding portion facing the substrate is provided with a recessed sub-portion, and the recessed sub-portion is correspondingly defined at a position the protruding portion and the second wire cross with each other.