US 12,274,006 B2
Printed circuit board with mold adhesion boundary for die attach pad
Andrew Christopher Laib, Fullerton, CA (US)
Assigned to Skyworks Solutions, Inc., Irvine, CA (US)
Filed by Skyworks Solutions, Inc., Irvine, CA (US)
Filed on Feb. 10, 2023, as Appl. No. 18/167,662.
Claims priority of provisional application 63/267,988, filed on Feb. 14, 2022.
Prior Publication US 2023/0262901 A1, Aug. 17, 2023
Int. Cl. H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01)
CPC H05K 1/185 (2013.01) [H05K 1/111 (2013.01); H05K 3/3452 (2013.01); H05K 2201/03 (2013.01); H05K 2201/10098 (2013.01)] 24 Claims
OG exemplary drawing
 
1. An electronics package for use in a module of an electronic device comprising:
a printed circuit board including an attachment pad configured to receive a circuit device thereon, the printed circuit board further including a printed circuit board solder mask disposed circumferentially about the attachment pad; and
one or more adhesion strips disposed between the attachment pad and the printed circuit board solder mask, the one or more adhesion strips extending around at least a portion of the attachment pad, the one or more adhesion strips configured to facilitate adhesion of a mold compound thereto and over the circuit device and to inhibit delamination of the mold compound.