US 12,274,002 B2
Multilayer circuit board and electronic-component mount multilayer board
Atsushi Kishimoto, Nagaokakyo (JP); Takumi Masaki, Nagaokakyo (JP); Masato Inaoka, Nagaokakyo (JP); Takashi Shimizu, Nagaokakyo (JP); Hiroshi Nishikawa, Nagaokakyo (JP); and Takahiro Takada, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Dec. 8, 2022, as Appl. No. 18/077,251.
Application 18/077,251 is a continuation of application No. PCT/JP2021/021507, filed on Jun. 7, 2021.
Claims priority of application No. 2020-114911 (JP), filed on Jul. 2, 2020.
Prior Publication US 2023/0101917 A1, Mar. 30, 2023
Int. Cl. H05K 1/11 (2006.01); H05K 1/02 (2006.01)
CPC H05K 1/116 (2013.01) [H05K 1/0206 (2013.01); H05K 2201/0141 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A multilayer circuit board comprising:
a board body including a plurality of insulator layers stacked upon each other;
a first land pattern at the board body to mount a passive component;
a second land pattern at the board body to mount an active component; and
a heat-dissipation layer between the insulator layers and extending along main surfaces of the insulator layers; wherein
the heat-dissipation layer includes a hole extending therethrough in a stacking direction of the insulator layers; and
in a plan view from the stacking direction, an area of the hole of the heat-dissipation layer is on an outer side of the first land pattern and overlaps the first land pattern.