US 12,274,001 B2
Printed circuit board
Sang Min Ahn, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Jan. 17, 2023, as Appl. No. 18/097,661.
Claims priority of application No. 10-2022-0093166 (KR), filed on Jul. 27, 2022.
Prior Publication US 2024/0040698 A1, Feb. 1, 2024
Int. Cl. H05K 1/11 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01)
CPC H05K 1/115 (2013.01) [H05K 3/4007 (2013.01); H05K 3/4647 (2013.01); H05K 2201/0367 (2013.01); H05K 2201/09563 (2013.01); H05K 2201/096 (2013.01); H05K 2201/10674 (2013.01)] 27 Claims
OG exemplary drawing
 
1. A printed circuit board, comprising:
a substrate including a plurality of wiring layers disposed on or in a plurality of build-up insulating layers;
a first metal post disposed on the substrate and connected to at least a portion of an uppermost wiring layer among the plurality of wiring layers;
a second metal post disposed on the substrate and connected to at least another portion of the uppermost wiring layer among the plurality of wiring layers;
a resist layer disposed on the substrate and embedding at least a portion of each of the first and second metal posts; and
a metal via penetrating through the resist layer on the second metal post and connected to the second metal post,
wherein a material of the resist layer is different from that of the plurality of the build-up insulating layers.