US 12,273,998 B2
Substrate for image sensor
Young Joon Son, Seoul (KR); Jee Heum Paik, Seoul (KR); and Hye Eun Kim, Seoul (KR)
Assigned to LG INNOTEK CO., LTD., Seoul (KR)
Appl. No. 17/768,144
Filed by LG INNOTEK CO., LTD., Seoul (KR)
PCT Filed Oct. 8, 2020, PCT No. PCT/KR2020/013778
§ 371(c)(1), (2) Date Apr. 11, 2022,
PCT Pub. No. WO2021/071303, PCT Pub. Date Apr. 15, 2021.
Claims priority of application No. 10-2019-0126183 (KR), filed on Oct. 11, 2019.
Prior Publication US 2024/0244746 A1, Jul. 18, 2024
Int. Cl. H05K 1/11 (2006.01); H04N 23/68 (2023.01)
CPC H05K 1/11 (2013.01) [H04N 23/687 (2023.01); H05K 2201/10083 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate comprising:
an insulating layer including a first insulating portion including a first open region; and
a second insulating portion, wherein a second open region is between the first insulating portion and the second insulating portion, and
a first pattern portion and a second pattern portion disposed on the insulating layer,
wherein the first pattern portion includes:
a first lead pattern portion disposed on the first insulating portion;
a second lead pattern portion disposed on the second insulating portion; and
a connection pattern disposed on the second open region and connected to the first and second lead pattern portions, and
wherein the second pattern portion includes:
a second reinforcing pattern disposed on the second insulating portion and spaced apart from the second lead pattern portion.