US 12,273,996 B2
Fiber sheet, and layered body, circuit board and electronic board using same
Tomohiro Fukao, Osaka (JP); Tomoaki Sawada, Osaka (JP); Takatoshi Abe, Osaka (JP); and Kyosuke Michigami, Hyogo (JP)
Assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
Appl. No. 17/441,492
Filed by PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
PCT Filed Mar. 26, 2020, PCT No. PCT/JP2020/013827
§ 371(c)(1), (2) Date Sep. 21, 2021,
PCT Pub. No. WO2020/196790, PCT Pub. Date Oct. 1, 2020.
Claims priority of application No. 2019-061650 (JP), filed on Mar. 27, 2019.
Prior Publication US 2022/0183154 A1, Jun. 9, 2022
Int. Cl. H05K 1/03 (2006.01); B32B 5/02 (2006.01); B32B 15/08 (2006.01); B32B 27/12 (2006.01)
CPC H05K 1/036 (2013.01) [B32B 5/024 (2013.01); B32B 15/08 (2013.01); B32B 27/12 (2013.01); H05K 1/0393 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2307/51 (2013.01); B32B 2457/08 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A fiber sheet comprising:
a resin layer consisting of a thermosetting resin and a curing agent; and
a fiber layer,
wherein
the fiber sheet is stretchable by 1% or more,
an initial tensile elastic modulus of the fiber sheet is 5 MPa or more and 10 GPa or less,
the thickness of the resin layer is within a range of 50 μm to 5000 μm,
a glass transition temperature of the thermosetting resin is 60° C. or lower, and
at least a portion of at least one surface of the fiber layer is impregnated with the resin layer.