US 12,273,995 B2
Power module
Taejung Kim, Cheonan-si (KR); Wonsan Na, Cheonan-si (KR); Baegeun Lee, Cheonan-si (KR); and Bohyeon Han, Cheonan-si (KR)
Assigned to AMOSENSE CO., LTD., Cheonan-si (KR)
Appl. No. 17/927,848
Filed by AMOSENSE CO., LTD., Cheonan-si (KR)
PCT Filed May 24, 2021, PCT No. PCT/KR2021/006393
§ 371(c)(1), (2) Date Nov. 25, 2022,
PCT Pub. No. WO2021/241951, PCT Pub. Date Dec. 2, 2021.
Claims priority of application No. 10-2020-0063548 (KR), filed on May 27, 2020; application No. 10-2020-0068013 (KR), filed on Jun. 5, 2020; application No. 10-2020-0068987 (KR), filed on Jun. 8, 2020; and application No. 10-2020-0071392 (KR), filed on Jun. 12, 2020.
Prior Publication US 2023/0217590 A1, Jul. 6, 2023
Int. Cl. H05K 1/03 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01)
CPC H05K 1/0306 (2013.01) [H05K 1/115 (2013.01); H05K 1/0209 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A power module comprising:
a PCB substrate having a multi-layer structure in which an internal electrode pattern is formed between a plurality of insulating layers and an upper electrode pattern is formed in a highest layer of the multi-layer structure;
a through hole configured to penetrate the PCB substrate;
a connection pin disposed in the through hole and connected to the upper electrode pattern; and
a detour circuit configured to connect the upper electrode pattern to the through hole through the internal electrode pattern.