US 12,273,681 B2
Microphone
Wenbing Zhou, Shenzhen (CN); Yongshuai Yuan, Shenzhen (CN); Wenjun Deng, Shenzhen (CN); Yujia Huang, Shenzhen (CN); Xin Qi, Shenzhen (CN); and Fengyun Liao, Shenzhen (CN)
Assigned to SHENZHEN SHOKZ CO., LTD., Shenzhen (CN)
Filed by SHENZHEN SHOKZ CO., LTD., Guangdong (CN)
Filed on Feb. 5, 2024, as Appl. No. 18/432,195.
Application 18/432,195 is a continuation of application No. 17/816,013, filed on Jul. 29, 2022, granted, now 11,924,608.
Application 17/816,013 is a continuation of application No. PCT/CN2021/112016, filed on Aug. 11, 2021.
Prior Publication US 2024/0179458 A1, May 30, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H04R 1/46 (2006.01); H04R 17/02 (2006.01); H04R 17/10 (2006.01)
CPC H04R 1/46 (2013.01) [H04R 17/025 (2013.01); H04R 17/10 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A microphone, comprising:
a vibration pickup assembly configured to generate vibration;
at least two acoustoelectric conversion elements configured to respectively receive the vibration of the vibration pickup assembly to generate an electrical signal;
at least one sampling module configured to convert electrical signals output by different acoustoelectric conversion elements of the at least two acoustoelectric conversion elements into digital signals, wherein,
each of the at least two acoustoelectric conversion element has a resonant frequency, and a difference between resonant frequencies of two of the at least two acoustoelectric conversion elements is greater than 1000 Hz; and
a shell structure, wherein the vibration pickup assembly is accommodated in the shell structure and generates the vibration in response to an external sound signal transmitted to the shell structure, and the vibration pickup assembly is connected with the shell structure through a peripheral side of the vibration pickup assembly.