US 12,273,222 B2
Semiconductor integrated circuit and signal processing device
Mitsuyuki Ashida, Yokohama Kanagawa (JP)
Assigned to KIOXIA CORPORATION, Tokyo (JP)
Filed by Kioxia Corporation, Tokyo (JP)
Filed on Aug. 30, 2022, as Appl. No. 17/898,914.
Claims priority of application No. 2022-045912 (JP), filed on Mar. 22, 2022.
Prior Publication US 2023/0308319 A1, Sep. 28, 2023
Int. Cl. H04L 25/03 (2006.01); H03K 19/0185 (2006.01); H04L 25/02 (2006.01)
CPC H04L 25/03834 (2013.01) [H03K 19/01855 (2013.01); H04L 25/0264 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A semiconductor integrated circuit, comprising:
a waveform shaping circuit configured to receive a signal, operate with a first inductance value in a first period, wherein during the first period, a rising edge or a falling edge of a waveform of the signal is enhanced, and operate with a second inductance value in a second period, wherein during the second period, the rising or falling edges of the waveform is not enhanced,
wherein the first inductance value is greater than the second inductance value,
wherein the waveform shaping circuit includes:
a first inductive element disposed on a first line connected between a first input node and a first output node;
a second inductive element disposed on a second line disposed in parallel with the first line between the first input node and the first output node; and
a first switching element disposed between the first input node and the second inductive element on the second line.