US 12,273,110 B2
Low-temperature coefficient ring oscillator, chip, and communication terminal
Chenyang Gao, Shanghai (CN); Yongshou Wang, Shanghai (CN); and Sheng Lin, Shanghai (CN)
Assigned to SHANGHAI VANCHIP TECHNOLOGIES CO., LTD., Shanghai (CN)
Filed by SHANGHAI VANCHIP TECHNOLOGIES CO., LTD., Shanghai (CN)
Filed on May 16, 2023, as Appl. No. 18/318,674.
Application 18/318,674 is a continuation of application No. PCT/CN2021/130948, filed on Nov. 16, 2021.
Claims priority of application No. 202011276399.8 (CN), filed on Nov. 16, 2020.
Prior Publication US 2023/0291393 A1, Sep. 14, 2023
Int. Cl. H03K 3/03 (2006.01); H03L 7/099 (2006.01)
CPC H03K 3/0315 (2013.01) [H03L 7/0995 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A low-temperature coefficient ring oscillator, wherein comprises a temperature tracking compensation circuit, an inverter oscillation circuit and a buffer shaping circuit, an output of the temperature tracking compensation circuit being connected to an input of the inverter oscillation circuit, an output of the inverter oscillation circuit being connected to an input of the buffer shaping circuit, and
the temperature tracking compensation circuit includes a temperature tracking compensation unit, a first enabling control unit, a voltage following unit, a first filter unit, and a second filter unit, the voltage following unit being connected to the temperature tracking compensation unit, the first enabling control unit, the first filter unit, and a bias current generation circuit, the second filter unit being connected to the voltage follower unit, the temperature tracking compensation unit, the first enabling control unit, the voltage follower unit, the first filter unit, and the second filter unit being grounded.