US 12,273,092 B2
Resonator device
Junichi Takeuchi, Chino (JP); Tomoyuki Kamakura, Matsumoto (JP); Ryuta Nishizawa, Nagano (JP); and Yukihiro Hashi, Shiojiri (JP)
Assigned to SEIKO EPSON CORPORATION, (JP)
Filed by SEIKO EPSON CORPORATION, Tokyo (JP)
Filed on May 1, 2024, as Appl. No. 18/651,849.
Application 18/651,849 is a continuation of application No. 17/456,237, filed on Nov. 23, 2021, granted, now 12,009,801.
Claims priority of application No. 2020-197300 (JP), filed on Nov. 27, 2020; and application No. 2021-132598 (JP), filed on Aug. 17, 2021.
Prior Publication US 2024/0283425 A1, Aug. 22, 2024
Int. Cl. H03H 9/09 (2006.01); H03H 9/05 (2006.01); H03H 9/125 (2006.01)
CPC H03H 9/09 (2013.01) [H03H 9/0514 (2013.01); H03H 9/125 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A resonator device, comprising:
a base that has a first surface and a second surface which are in a front and back relationship;
a resonator element that is positioned on a first surface side with respect to the base, and that includes a resonator substrate and an electrode disposed at a surface of the resonator substrate on a base side thereof;
a conductive layer that is disposed at the first surface;
a metal bump that is disposed between the base and the resonator element, and that electrically couples the conductive layer and the electrode while bonding the base and the resonator element;
at least one of
a first low elastic modulus layer that is interposed between the base and the conductive layer, that overlaps the metal bump in a plan view of the base, and that has an elastic modulus smaller than that of the metal bump, and
a second low elastic modulus layer that is interposed between the resonator substrate and the electrode, that overlaps the metal bump in the plan view of the base, and that has an elastic modulus smaller than that of the metal bump; and
through electrodes that do not overlap the first low elastic modulus layer and do not overlap the second low elastic modulus layer in the plan view of the base.