US 12,273,072 B2
Envelope detector with clamping circuitry
Cheng Tan, Denver, CO (US); Bruce Charles Fischer, Jr., Lafayette, CO (US); and Brian French, Boulder, CO (US)
Assigned to QUALCOMM Incorporated, San Diego, CA (US)
Filed by QUALCOMM Incorporated, San Diego, CA (US)
Filed on Dec. 29, 2021, as Appl. No. 17/646,405.
Prior Publication US 2023/0208362 A1, Jun. 29, 2023
Int. Cl. H03F 1/02 (2006.01); H03F 3/19 (2006.01); H04B 1/40 (2015.01)
CPC H03F 1/0233 (2013.01) [H03F 3/19 (2013.01); H03F 2200/105 (2013.01); H03F 2200/451 (2013.01); H04B 1/40 (2013.01)] 15 Claims
OG exemplary drawing
 
1. An envelope detection circuit comprising:
a first diode having an anode coupled to an input node of the envelope detection circuit and having a cathode coupled to an output node of the envelope detection circuit;
a first capacitive element coupled in shunt between the output node and a reference potential node;
a clamping circuit coupled in shunt between the input node and the reference potential node, wherein the clamping circuit comprises a first resistive element coupled in series with a second diode; and
an impedance matching circuit coupled between the input node of the envelope detection circuit and the anode of the first diode, wherein the impedance matching circuit comprises:
a second capacitive element coupled in series between the input node of the envelope detection circuit and the anode of the first diode; and
an inductive element coupled in shunt between the anode of the first diode and the reference potential node.