| CPC H02M 7/003 (2013.01) [H05K 1/0256 (2013.01); H05K 3/303 (2013.01); H05K 2203/167 (2013.01)] | 20 Claims |

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1. An apparatus comprising:
an electrically insulative substrate having a first surface facing a first direction and a second surface forming an opposing side of the first surface and facing a second direction different from the first direction, the first surface having a first alignment feature configured to align a circuit board with the electrically insulative substrate, the second surface having a second alignment feature configured to align at least one power module pin with the electrically insulative substrate; and
a routing feature coupled to the electrically insulative substrate configured to route a harness coupled to the circuit board.
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