US 12,272,922 B2
Electronic chip support device and corresponding manufacturing method
Fabien Quercia, Saint Marcelin (FR); and Jean-Michel Riviere, Froges (FR)
Assigned to STMICROELECTRONICS (GRENOBLE 2) SAS, Grenoble (FR)
Filed by STMICROELECTRONICS (GRENOBLE 2) SAS, Grenoble (FR)
Filed on Jan. 9, 2024, as Appl. No. 18/408,149.
Application 18/408,149 is a division of application No. 17/229,710, filed on Apr. 13, 2021, granted, now 11,916,353.
Claims priority of application No. 2003845 (FR), filed on Apr. 16, 2020.
Prior Publication US 2024/0146019 A1, May 2, 2024
Int. Cl. H01S 5/02345 (2021.01); H01L 23/00 (2006.01)
CPC H01S 5/02345 (2021.01) [H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/18165 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a support substrate having a first face;
an electronic chip having a second face coupled to the first face of the support substrate by an adhesive; and
a plurality of arcuate wire bonds projecting from the first face of the support substrate, the second face of the electronic chip on contact areas of the plurality of arcuate wire bonds, the adhesive being between the plurality of arcuate wire bonds, each one of the plurality of arcuate wire bonds including:
a first end and a second end coupled to the first face of the support substrate; and
an extremum between the first end and the second end, the extremum contacting the second face of the electronic chip at the contact areas, the contact areas being exposed from the adhesive.