US 12,272,883 B2
Electronic device provided with 5G antenna
Songyi Lee, Seoul (KR); Moonsoo Song, Seoul (KR); Chisang You, Seoul (KR); Sungjoon Hong, Seoul (KR); and Youngtaek Hong, Seoul (KR)
Assigned to LG ELECTRONICS INC., Seoul (KR)
Appl. No. 17/755,059
Filed by LG ELECTRONICS INC., Seoul (KR)
PCT Filed Oct. 30, 2019, PCT No. PCT/KR2019/014419
§ 371(c)(1), (2) Date Apr. 20, 2022,
PCT Pub. No. WO2021/085667, PCT Pub. Date May 6, 2021.
Prior Publication US 2022/0393349 A1, Dec. 8, 2022
Int. Cl. H01Q 5/307 (2015.01); H01Q 1/24 (2006.01); H01Q 1/48 (2006.01); H01Q 9/04 (2006.01); H01Q 21/06 (2006.01); H04B 1/40 (2015.01); H04B 7/0413 (2017.01)
CPC H01Q 5/307 (2015.01) [H01Q 1/243 (2013.01); H01Q 1/48 (2013.01); H01Q 9/045 (2013.01); H01Q 21/06 (2013.01); H04B 1/40 (2013.01); H04B 7/0413 (2013.01)] 17 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
an antenna pattern formed on a first substrate; and
a ground pattern formed on a second substrate disposed under the first substrate;
wherein the antenna pattern comprises:
a first metal pattern having a first region and a second region connected to the first region and having a larger width than the first region;
a second metal pattern spaced apart from the first metal pattern and having a third region and a fourth region connected to the third region and having a larger width than the third region; and
a first feeding pattern disposed between the first metal pattern and the second metal pattern,
wherein the antenna pattern constitutes a first antenna further comprising a plurality of vias configured to connect first and second metal patterns and the ground pattern at an end portion of the first substrate,
wherein the antenna pattern constitutes a second antenna adjacent to the first antenna further comprising a plurality of vias configured to connect the first and second metal patterns and the ground pattern at an end portion of the first substrate,
wherein the ground pattern disposed under the second substrate is connected to a system ground in a partial region through a PCB provided in the electronic device, and
wherein the ground pattern is spaced apart from the system ground in an area other than the partial region to increase bandwidths of the first antenna and the second antenna
wherein the first metal pattern and the second metal pattern are connected to the ground pattern of the second substrate at a central region of the second substrate corresponding to edges of the second region and the fourth region.