| CPC H01Q 1/38 (2013.01) [H01Q 1/24 (2013.01); H01Q 5/25 (2015.01); H04M 1/0268 (2013.01); H04M 1/0277 (2013.01); H05K 1/14 (2013.01)] | 16 Claims |
|
1. A printed board assembly (PBA) comprising:
a first printed circuit board (PCB);
a second PCB disposed parallel to the first PCB and configured to comprise a conductive area;
a first interposer surrounding a space between the first PCB and the second PCB;
a shield can adjacent to the first PCB or the second PCB; and
a wireless communication circuit,
wherein the first interposer comprises:
a first partition wall structure configured to provide shielding for at least one electronic component disposed on the PBA, and
a second partition wall structure connected to the first partition wall structure and configured to comprise a dielectric material, the second partition wall structure comprising a conductive via configured to connect the first PCB and the second PCB,
wherein the wireless communication circuit is configured to transmit and/or receive a signal in a specified frequency band by feeding power to the conductive area of the second PCB through the conductive via,
wherein a power feeding line disposed on the first PCB and electrically connected to a wireless communication circuit is electrically connected to a second ground of the second PCB through the conductive via,
wherein the at least one electronic component is disposed in the space,
wherein the space comprises:
a first space surrounded by the first partition wall structure, and
a second space surrounded by the first partition wall structure and the second partition wall structure,
wherein the PBA comprises:
a first electronic component disposed in the first space, and
a second electronic component disposed in the second space, and
wherein the wireless communication circuit transmits or receives a signal in a specified frequency band by feeding power to the conductive area through the shield can.
|