| CPC H01Q 1/24 (2013.01) [H01Q 5/307 (2015.01); H01Q 9/0407 (2013.01)] | 20 Claims |
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1. An electronic device comprising:
a housing;
an antenna structure disposed in an inner space of the housing, the antenna structure comprising:
a substrate having a first substrate surface facing in a first direction and a second substrate surface facing in a second direction opposite to the first substrate surface, and
a plurality of chip antennas sequentially arranged on the first substrate surface in a third direction perpendicular to the first direction,
the plurality of chip antennas comprising a first chip antenna, a second chip antenna, and a third chip antenna sequentially arranged on the first substrate surface, each of the first chip antenna, the second chip antenna, and the third chip antenna comprising an antenna element,
wherein the first chip antenna and the second chip antenna are separated in the third direction by a first separation space, the second chip antenna and the third chip antenna are separated in the third direction by a second separation space, and at least one of the first separation space and the second separation space has a first width in the third direction;
a wireless communication circuit disposed in the inner space and configured to transmit or receive a radio signal in a designated frequency band through the antenna structure; and
a first bracket comprising a first protrusion and a second protrusion that protrude in the second direction to correspond to the first substrate surface of the substrate and are spaced apart from each other,
wherein at least one of the first protrusion and the second protrusion has a second width that is greater than the first width in the third direction,
wherein the first protrusion overlaps with at least a portion of the first chip antenna and at least a portion of the second chip antenna when viewed from above the first substrate surface, and
wherein the second protrusion overlaps with at least another portion of the second chip antenna and at least a portion of the third chip antenna when viewed from above the first substrate surface.
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