US 12,272,736 B2
FinFET and gate-all-around FET with selective high-k oxide deposition
Tsung-Han Tsai, Kaohsiung (TW); Jen-Hsiang Lu, Taipei (TW); and Shih-Hsun Chang, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jun. 20, 2023, as Appl. No. 18/337,767.
Application 16/889,245 is a division of application No. 16/048,833, filed on Jul. 30, 2018, granted, now 10,672,879, issued on Jun. 2, 2020.
Application 18/337,767 is a continuation of application No. 17/523,242, filed on Nov. 10, 2021, granted, now 11,721,739.
Application 17/523,242 is a continuation of application No. 16/889,245, filed on Jun. 1, 2020, granted, now 11,177,361, issued on Nov. 16, 2021.
Prior Publication US 2023/0335612 A1, Oct. 19, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 29/423 (2006.01); H01L 21/02 (2006.01); H01L 29/40 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/786 (2006.01)
CPC H01L 29/42392 (2013.01) [H01L 21/02359 (2013.01); H01L 29/401 (2013.01); H01L 29/66545 (2013.01); H01L 29/7851 (2013.01); H01L 29/78696 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device structure, comprising:
a first gate spacer and a second gate spacer formed over a semiconductor substrate, longitudinally extending along a first direction, and separated from each other by a gate electrode layer;
a first insulating layer longitudinally extending along a second direction to pass through the gate electrode layer, the first gate spacer and the second gate spacer; and
a gate dielectric layer having a top surface covered by the gate electrode layer;
wherein a top width of the gate dielectric layer is less than a top width of the gate electrode layer,
wherein the first gate spacer, the second gate spacer, and the first insulating layer have a first hydrophobic surface, a second hydrophobic surface, and a third hydrophobic surface, respectively, and
wherein the first hydrophobic surface, the second hydrophobic surface, and the third hydrophobic surface are in direct contact with a first sidewall surface, a second sidewall surface, and a third sidewall surface of the gate electrode layer, respectively.