US 12,272,704 B2
Image sensor and method of manufacturing the same
Kyeongjae Byeon, Hwaseong-si (KR); Jinyoung Kim, Ulsan (KR); Seungjoo Nah, Gwangju (KR); and Heegeun Jeong, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on May 13, 2022, as Appl. No. 17/744,045.
Claims priority of application No. 10-2021-0121117 (KR), filed on Sep. 10, 2021.
Prior Publication US 2023/0082070 A1, Mar. 16, 2023
Int. Cl. H01L 27/146 (2006.01)
CPC H01L 27/14612 (2013.01) [H01L 27/14621 (2013.01); H01L 27/14623 (2013.01); H01L 27/14627 (2013.01); H01L 27/14645 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An image sensor comprising:
a substrate including a first region and a second region surrounding the first region, active pixels in the first region and optical black (OB) pixels in the second region;
a light sensing element in the substrate;
a planarization layer on the light sensing element;
a color filter array layer on the planarization layer on the first region of the substrate, the color filter array layer including color filters;
a light blocking metal pattern on the planarization layer on the second region of the substrate;
a dummy color filter layer on the light blocking metal pattern on a portion of the second region adjacent to the first region of the substrate;
microlens on the color filter array layer, and
a light blocking color filter layer on the light blocking metal pattern on the second region of the substrate,
wherein the light blocking color filter layer being spaced apart from the dummy color filter layer in a horizontal direction substantially parallel to an upper surface of the substrate.