US 12,272,687 B2
Semiconductor device package with conductive pillars and reinforcing and encapsulating layers
Ya Fang Chan, Kaohsiung (TW); and Yuan-Feng Chiang, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Dec. 6, 2022, as Appl. No. 18/076,382.
Application 18/076,382 is a continuation of application No. 16/675,011, filed on Nov. 5, 2019, granted, now 11,521,958.
Prior Publication US 2023/0094668 A1, Mar. 30, 2023
Int. Cl. H01L 25/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/762 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01)
CPC H01L 25/50 (2013.01) [H01L 21/486 (2013.01); H01L 21/563 (2013.01); H01L 21/76224 (2013.01); H01L 23/3128 (2013.01); H01L 23/49833 (2013.01); H01L 23/49861 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 2224/02333 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A semiconductor package structure, comprising:
an electrical connection member comprising a reinforcing layer and a conductive pillar passing through the reinforcing layer;
an encapsulant encapsulating the electrical connection member;
a redistribution layer disposed over the conductive pillar;
a plurality of electronic components disposed over the redistribution layer;
wherein the conductive pillar has a first pillar portion and a second pillar portion, and wherein the second pillar portion is disposed under the redistribution layer and a lateral surface of the second pillar portion is covered by the encapsulant, and the first pillar portion is in direct contact with the second pillar portion and a lateral surface of the first pillar portion is covered by the reinforcing layer, and a height of the second pillar portion is greater than a height of the first pillar portion;
wherein the plurality of the electronic components comprise a first electronic component and a second component, and the first electronic component has a first surface facing the redistribution layer and the second electronic component has a second surface facing the redistribution layer, and wherein the first surface is not level with the second surface;
wherein the first electronic component has a first electrical contactor protruded beyond the first surface of the first electronic component and located over a pad of the redistribution layer, a center of the first electrical contactor of the first electronic component and a center of the pad of the redistribution layer are misaligned with each other in a cross-sectional view.