US 12,272,681 B2
LED display panel, LED display apparatus having the same and method of fabricating the same
Seong Kyu Jang, Ansan-si (KR); Seom Geun Lee, Ansan-si (KR); Chan Seob Shin, Ansan-si (KR); and Ho Joon Lee, Ansan-si (KR)
Assigned to Seoul Viosys Co., Ltd., Ansan-si (KR)
Filed by Seoul Viosys Co., Ltd., Ansan-si (KR)
Filed on Dec. 11, 2023, as Appl. No. 18/535,545.
Application 18/535,545 is a continuation of application No. 17/866,249, filed on Jul. 15, 2022, granted, now 11,842,987.
Application 17/866,249 is a continuation of application No. 16/855,258, filed on Apr. 22, 2020, granted, now 11,424,224, issued on Aug. 3, 2022.
Claims priority of provisional application 62/837,800, filed on Apr. 24, 2019.
Prior Publication US 2024/0105686 A1, Mar. 28, 2024
Int. Cl. H01L 25/075 (2006.01); H10H 20/01 (2025.01); H10H 20/855 (2025.01); H10H 20/857 (2025.01)
CPC H01L 25/0753 (2013.01) [H10H 20/018 (2025.01); H10H 20/855 (2025.01); H10H 20/857 (2025.01); H10H 20/0363 (2025.01); H10H 20/0364 (2025.01)] 17 Claims
OG exemplary drawing
 
1. A light emitting module, comprising:
a circuit board having pads;
a light emitting device electrically connected to the pads and arranged on the circuit board;
a buffer layer covering a side surface of the light emitting device; and
a cover layer surrounding a periphery of the light emitting device and contacting with the buffer layer,
wherein:
a region of the buffer layer is disposed next to the light emitting device and has a groove,
a width of the groove corresponds to a region having a concave shape at an upper surface of the buffer layer in a cross-sectional view, and
the cover layer includes a material including black epoxy or black silicone.